Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
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  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film

Introduction

The Reactive hot melt adhesive film is a modified hot melt film. It can be bonded to epoxy materials. Flame retardant PP hot melt film, can reach UL94V0 flame retardant grade. It can be used for IC card bonding.So it can be used in the electronics industry.

 

Product Specification

The Regular thickness is 0.01~0.2mm

With release paper or without release paper

The max width is 160CM

All is also can be customized according to the customer`s request

 

Product Physical Property Sheets

Softening Point(Ring and Ball) : 122 ℃

 

Product Packaging

100M2/Roll,Woven bags lined with plastic bags or Carton.

It can be customized according to the customer request.

 

Application

The product is mainly used for bonding the epoxy sheet, metal products, ABS, nylon, cotton, polyester, polyester cloth, nylon, Oxford, PVC, PU and other materials.

 

Storage condition

Hot melt adhesive film for bonding the polyethylene material store in cool and dry condition.

 

Our Advantage

Jiangyin Weitao can produce the PA/PES/EAA/EVA/PU/TPU hot melt adhesive film /granules/powder and TPU thin film(without glue). And the best feature of our products is environmentally friendly halogen free Flame-Retardant Hot melt adhesive film.

Our hot melt adhesive films can use for bonding/laminating the fabric, leather, EPDM rubber ,metal aluminum, paper, shoes, bookbinding, garment accessory(label), IC card encapsulation and PVC/PET/TPU material etc.

Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
Reactive Hot Melt Adhesive Film
+
  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film
  • Reactive Hot Melt Adhesive Film

Reactive Hot Melt Adhesive Film

The Reactive hot melt adhesive film is a modified hot melt film. It can be bonded to epoxy materials. Flame retardant PP hot melt film, can reach UL94V0 flame retardant grade. It can be used for IC card bonding.So it can be used in the electronics industry.


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