In recent years, the global electronics industry has developed rapidly and the scale of the industry has expanded significantly, which has greatly promoted the development of the electronic adhesive materials industry. Although electronic adhesive materials account for a relatively small proportion of the entire adhesive material family, they have attracted great attention in the industry because of their high value-added characteristics. This type of adhesive needs to have key properties such as excellent conductive or insulating properties, good thermal stability, low ion content, fast curing properties, reliable bonding strength and low playability to meet the stringent requirements of modern electronic manufacturing.

With the application of nanotechnology and new polymer materials, the performance of electronic-grade adhesives has been significantly improved. Innovative products such as conductive silver glue and UV-cured epoxy resin continue to emerge, providing strong support for emerging fields such as electronic manufacturing, semiconductors, 5G communications, and new energy vehicles. Advances in technology enable electronic-grade adhesives to better adapt to complex application environments and make important contributions to the reliability and performance optimization of electronic products.

The hot melt adhesive film produced by Weitao can be used for IC card packaging. This product is our specialty product. It is suitable for heat packaging and heat pressing of IC cards, smart cards, (contact and non-contact). In order to meet the different requirements of our customers, our company replaces and surpasses imported products. Our company's products are highly practical and have a wider open temperature range than ordinary products. This feature determines that a certain temperature difference in the temperature of the user's equipment is allowed while ensuring the bonding strength. Comply with ISO7816 standard requirements for chip packaging fastness.